STS Multiplex Etch
Inductively Coupled Plasma (ICP) Reactive Ion Etcher (RIE)
Equipment Information
Asset Sticker
102034
Manufacturer
STS
Model
Multiplex ICP Etch
Equipment Type
Inductively Coupled Plasma (ICP) Reactive Ion Etcher (RIE)
Application
Wafer etching
Description
High plasma density, low operating pressure, high etch rate, excellent etch uniformity. Suitable for etching a large range of materials.
Description
High plasma density, low operating pressure, high etch rate, excellent etch uniformity. Suitable for etching a large range of materials.
Contact Information
Contact
Glenn Walker
Email
glenn.walker@griffith.edu.au
Alternative Contact
Alternative Email
Other Information
Campus
Nathan
Certification
Group
SCG - Griffith Sciences
Element
QMF - Queensland Microtechnology Facility
Facility
Access
Staff Only
iLab Link
Other Links
Research or Teaching
Research
Research Categories
4009 - Electronics, sensors and digital hardware
Restrictions
Visibility
Public